1
2
3
4
5
6
7

Symposium FB
Flexible and Stretchable Electronics: Materials, Devices and Applications

Conveners:
Mario PROSA, CNR-ISMN, Italy (Programme Chair)
John A. ROGERS, University of Illinois, USA
W. Hong YEO, Georgia Institute of Technology, USA

Members:
Tricia Breen CARMICHAEL, University of Windsor, Canada
Vladimir DYAKONOV, Julius-Maximilian University, Germany
Guglielmo FORTUNATO, CNR-IMM, Italy
Martin HEENEY, Imperial College London, UK
Yonggang HUANG, Northwestern University, USA
Olle INGANAS, Linkoping University, Sweden
Jae-Woong JEONG, KAIST, South Korea
Martin KALTENBRUNNER, Johannes-Kepler University Linz, Austria
Dae-Hyeong KIM, Seoul National University, South Korea
Taek-Soo KIM, KAIST, South Korea
Virgilio MATTOLI, Istituto Italiano di Tecnologia, Italy
Ivan MINEV, Technical University Dresden, Germany
Christian MUELLER, Chalmers University of Technology, Sweden
Arokia NATHAN, Cambridge Touch Technologies, UK
Yong-Young NOH, Pohang University of Science and Technology, South Korea
Tsuyoshi SEKITANI, Osaka University, Japan
Xing SHENG, Tshinghua University, China
Manos M. TENTZERIS, Georgia Institute of Technology, USA
Shizuo TOKITO, Yamagata University, Japan
Luisa TORSI, University of Bari, Italy
Junliang YANG, Central South University, China
Yang YANG, University of California, Los Angeles, USA
 
Kenjiro FUKUDA, RIKEN, Japan
Matti HAUKKA, University of Jyväskylä, Finland
Matjaz HUMAR, Jozef Stefan Institute, Slovenia
Sven INGEBRANDT, Aachen University, Germany
Martin KALTENBRUNNER, Johannes Kepler University Linz, Austria
Robert NAWROCKI, Purdue University, USA
Luisa PETTI, University of Bolzano, Italy
Marc RAMUZ, EMSE - Saint Etienne, France
Sunmi SHIN, National University of Singapore, Singapore
Felice TORRISI, Imperial College London, UK
Yoeri VAN DE BURGT, Eindhoven University of Technology, Netherlands
 
Flexible and stretchable electronics is empowering unprecedented approaches to ubiquitous electronics: owing to its mechanical compliance, it offers opportunities for many new applications in energy transformation and storage, deformable displays, wearable electronic systems, memory devices, compliant large area electronics and in bioelectronics.
Major challenges for research is to achieve both excellent long-term reliable mechanical soundness and electronic performance, joined with compatibility with living tissues and low-toxicity when biomedical applications are involved.
This symposium offers a suitable forum for discussion of timely research in materials, their mechanics, designs, modelling, novel phenomena and techniques enabling the economic fabrication of flexible, stretchable and ultra-conformable electronics for the diverse fields of applications, as well as providing insights for future roadmaps.
Session Topics

FB-1 Materials and fabrication processes

  • Emerging Organic, Inorganic and Hybrid active device materials (conductors, semiconductors, dielectrics)
  • Functional electronic inks for flexible and stretchable electronics
  • Advanced growing, printing and patterning technologies for flexible and stretchable electronics
  • Nonplanar fabrication processes
  • Substrates and encapsulating/barrier materials and methods

FB-2 Device physics, mechanics and design

  • Charge injection, transport and generation phenomena in materials for flexible/stretchable electronics
  • Design of highly stretchable/deformable and conformable electronics
  • Mechanics of thin film deposited on (or embedded in) plastic substrates
  • Biomechanics of soft biological tissue/device interfaces
  • Mechanical, thermal and electronic modelling of flexible/stretchable hybrid electronic systems and components

FB-3 Applications of flexible/stretchable electronics

  • Electronics and optoelectronics: flexible/stretchable thin film transistors, bendable/stretchable/conformable electronic circuits, sensors, light emitting diodes
  • Flexible energy conversion/storage: solar cells, thermoelectric generators, fuel cells, batteries, supercapacitors, energy harvesters
  • Biomedical: conformable neural interfaces, implantable soft devices, bioMEMS, prosthetic skin
  • Transducers: e-textiles, wearable electronics, cyber-skin, flexible MEMS, microsensors, microactuators, etc
  • Bio-inspired systems in organic electronics for biotechnology and medical applications

SUBMIT AN ABSTRACT

Cimtec 2022

Copyright © Techna Group S.r.l.
C.F.-P.I. 03368230409
Privacy Policy - Cookie Policy - Software Commercio Elettronico by Pianetaitalia.com